Huawei Announced Kirin 970 Chipset With AI Features at IFA 2017
Today at IFA 2017 event, Huawei has unveiled next-generation chipset for smartphones. Richard Yu, CEO of Huawei revealed Huawei’s vision for the future of artificial intelligence with the launch of the Kirin 970 chipset.
Richard Yu said, “As we look to the future of smartphones, we’re at the threshold of an exciting new era. Mobile AI = On-Device AI + Cloud AI. Huawei is committed to turning smart devices into intelligent devices by building end-to-end capabilities that support coordinated development of chips, devices, and the cloud. The ultimate goal is to provide a significantly better user experience. The Kirin 970 is the first in a series of new advances that will bring powerful AI features to our devices and take them beyond the competition.”
The Kirin 970 is powered by an 8-core CPU and a new generation 12-core GPU. Built using a 10nm advanced process, the chipset packs 5.5 billion transistors into an area of only one cm. Huawei’s new flagship Kirin 970 is Huawei’s first mobile AI computing platform featuring a dedicated Neural Processing Unit (NPU). Compared to a quad-core Cortex-A73 CPU cluster, the Kirin 970’s new heterogeneous computing architecture delivers up to 25x the performance with 50x greater efficiency. Simply put, the Kirin 970 can perform the same AI computing tasks faster and with far less power. In a benchmark image recognition test, the Kirin 970 processed 2,000 images per minute, which was faster than other chips on the market. Additionally, the chipset boasts support for 4.5G Cat.18 LTE for download speeds up to 1.2Gbps.
New developments in AI require joint effort across the entire value chain, involving tens of millions of developers, and the experience and feedback of hundreds of millions of users. Huawei is positioning the Kirin 970 as an open platform for mobile AI, opening up the chipset to developers and partners who can find new and innovative uses for its processing capabilities.